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Bonding Strength Tester Product List

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Netherlands XYZTEC Bond Tester Sigma (Joint Strength Testing Machine)

Netherlands XYZTEC Bond Tester Sigma (Joint Strength Testing Machine)

The latest model Sigma meets a wide range of bonding strength measurement needs with just one unit, leading the global market.

The latest model from Dutch company XYZTEC. Equipped with a rotary head capable of accommodating six sensors, it boasts excellent operability, measurement accuracy, and multifunctionality, overwhelming competitors and achieving high cost performance. The rotary measurement head, high-speed operating stage, and rotary share sensor contribute to reduced work time. It also comes standard with a simplified pattern recognition automatic measurement function. By adding an optional image processing function, it can support more advanced automatic measurement and automatic recognition of failure modes. It has been widely adopted by major semiconductor, power device, and various electronic device manufacturers in Japan and around the world.

  • Testing Equipment and Devices
  • Bonding Strength Tester

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Bond Tester for the Automotive Industry: SS-30WD

Bond Tester for the Automotive Industry: SS-30WD

Share, pull, peel, push—covering all bonding strength tests with one device.

In the automotive industry, the bonding strength of components is crucial for ensuring safety and durability. In particular, the strength of joints using adhesives or welding directly affects vehicle safety. Evaluating bonding strength requires various testing methods, but using different testing machines for each method can be costly and time-consuming. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, meeting all needs for evaluating bonding strength. 【Application Scenarios】 - Adhesive strength testing of body parts - Bonding strength testing of interior components - Mounting strength testing of electronic components 【Benefits of Implementation】 - Supports a variety of tests with a single machine, reducing costs and time associated with testing - Enables reliable data acquisition through high-precision measurements - Improves analysis efficiency with data processing software

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  • Other measurement and measuring equipment
  • Bonding Strength Tester

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Bond Tester for Medical Devices 'SS-30WD'

Bond Tester for Medical Devices 'SS-30WD'

Share, pull, peel, push – one device supports a variety of strength tests.

In the quality control of the medical device industry, the strength of joints is crucial to ensure the safety and reliability of products. Particularly in medical devices that relate to patient safety, delamination or damage at the joints can lead to serious accidents. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, thoroughly evaluating joint strength. 【Usage Scenarios】 - Quality control in the manufacturing process of medical devices - Evaluation of parts requiring joint strength - Durability testing of products 【Benefits of Implementation】 - Improvement in product quality - Reduction of accident risks - Provision of highly reliable products

  • LED
  • Other measurement and measuring equipment
  • Bonding Strength Tester

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Bond Tester for Electronic Devices 'SS-30WD'

Bond Tester for Electronic Devices 'SS-30WD'

Share, pull, peel, push – one device supports a variety of strength tests.

In the electronics industry, product reliability is one of the most important issues. The bonding strength of electronic components is a crucial factor that affects the durability and performance of products, and poor bonding can lead to early product failure. The bond tester 'SS-30WD' supports a variety of tests such as shear, pull, peel, and push, meeting all needs for reliability evaluation of electronic devices. 【Usage Scenarios】 - Evaluation of bonding strength of electronic components - Strength testing of semiconductor packages - Reliability assessment of surface-mounted components - Quality control of electronic devices 【Benefits of Implementation】 - Improvement in product quality - Reduction of defective products - Gaining customer trust - Shortening of product development time

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  • Other measurement and measuring equipment
  • Bonding Strength Tester

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Bond Tester for Semiconductors 'SS-30WD'

Bond Tester for Semiconductors 'SS-30WD'

Share, pull, peel, push, for strength testing of fine joints.

In the semiconductor industry, evaluating the strength of fine joints is crucial to ensure product reliability. Particularly as miniaturization progresses, even slight abnormalities in joints can affect the overall performance of the product. Variations in joint strength and poor bonding not only reduce product yield but also compromise the reliability of the final product. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, meeting all needs for strength evaluation of fine joints. 【Application Scenarios】 - Shear tests for die, ball, and bump - Wire pull tests - Peel tests (90°/180°) - Push tests 【Benefits of Implementation】 - Wide joint evaluation due to support for various tests - Reliable data acquisition through high-precision measurements - Improved analysis efficiency with data processing software - Quality assurance with JQA calibration certificates

  • LED
  • Other measurement and measuring equipment
  • Bonding Strength Tester

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Bonding Strength Testing Machine "MFM Series"

Bonding Strength Testing Machine "MFM Series"

CE, RoHS certified device! Bond tester equipped with proprietary technology (patented).

The "MFM Series" is a bonding strength testing machine (bond tester) that can meet all needs, including strength tests for various electronic components, strength tests for solder joints, and strength tests for wire bonding. It adopts the unique patented technology "VPM (Vertical Position Movement)" to achieve multifunctionality, high performance, high precision, and high reproducibility. It is suitable for quality control and research and development of various electronic components for semiconductors and automotive applications in high-density mounting. 【Features】 ■ VPM TECHNOLOGY (Vertical Point Movement) ■ DGFT (Digital Force Technology) ■ Dynamic Transducer Technology ■ Auto-Range Technology (Fully Automatic Range Technology) ■ Excellent System Rigidity & Control (Equipment Rigidity and Control Software) *For more details, please download the PDF or feel free to contact us.

  • Testing Equipment and Devices
  • Strength Testing Equipment
  • Tester
  • Bonding Strength Tester

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